Heimann Sensor MEMS Expert Frank Hermann presents at Fraunhofer IPMS Industry Partner Day

The title of Frank Hermann’s presentation and panel discussion was "How MEMS innovations scale non-contact thermography”.

As a global pioneer and market leader in infrared thermopile arrays, Frank enjoyed presenting Heimann Sensor's latest technological milestones. It was a great opportunity to showcase how the long-term strategic partnership and joint MEMS development with the Fraunhofer IPMS are pushing the boundaries of non-contact temperature measurement.

The energy and good discussions throughout the day once again highlighted the strength of Dresden’s semiconductor, sensor, and photonics ecosystem. Bringing together leading innovators from both industry and cutting-edge research is what makes this event so impactful.

Combining Heimann Sensor's advanced sensor designs with the institute's cutting-edge 200 mm CMOS-compatible pilot production line, high-volume manufacturing is successfully scaled. The current joint innovations focus on integrating novel thermoelectric materials to achieve unprecedented thermal resolutions below 20 millikelvin - opening up massive opportunities for next-generation industrial imaging, smart automation, medical diagnostics, robotics and autonomous mobility.

Beyond the presentation, the event provided an excellent stage for networking. Many thanks to the entire Fraunhofer Institute for Photonic Microsystems IPMS team for the ongoing cooperation, the invitation, and for bringing together such an inspiring community of innovators.