Sensor innovations support packaging industry

Baumer is presenting itself at this year's Interpack-Components (May 8 - 10 in Düsseldorf) with many new and special sensor solutions. Featuring a wide product range, the sensor manufacturer provides varied support for complex process chains in the packaging industry, including reliability as as well cost savings during operation, installation and plant conception.

Baumer is introducing the PosCon 3D edge sensor as one of its newest innovations at Interpack/Components. The PosCon 3D is an interesting solution for  complex distance and angle calculations which occur regularly in the packaging industry. The sensor reliably measures edge positions as well as object and gap widths. It is easy to install, quick to configure, and low-maintenance during operation.

That also goes for sensors in the NextGen series, where Baumer recently expanded its varied range of photoelectric sensor types by the ultrasonic model U500. Identical sizes, a wear-free teach procedure, and reduced adjustment effort ensure flexibility and time savings during packaging line planning and commissioning.

Furthermore, the new 2.4.0 version of Application Suite is available for Baumer VeriSens vision sensors. Its expanded range of functions opens up new application possibilities such as the new pattern matching feature for packaging inspection. The more flexible VeriSens web interface can now be adapted to the customer's corporate identity specifications by the OEM.